SE-5AT Semiconductor Series|Optical Inspection
Intelligent optical wafer/chip surface defect and height detection equipment

Wafer Inspection Technology
Advantages and Features
Measurement technology
Provides precise optical inspection and analysis of defects generated during the semiconductor wafer manufacturing process, using an auto-focus microscope module with an XYZ three-axis displacement platform (integrated optical ruler) to perform flying photography to capture wafer/chip surface images.
Exclusive algorithm
Image comparison and AI image deep learning can be performed based on the defects to be detected to reduce the occurrence of overkill and underkill.
Optical technology
Customizable tolerances can be used to automatically sort OK/NG parts. The defect area, defect quantity, and defect location can be calculated and marked. Automation can also be integrated to improve inspection efficiency.
Measurement Applications
It can be used with a white light confocal module to measure the height variation of wafers/chips. This module has the advantages of high precision, high speed measurement and is not affected by materials. The height measurement results are represented by a color distribution diagram, and the image is intuitive. It can also perform non-contact thickness measurement, including THK/TTV/WARP/BOW.
Standard model
Automatic optical testing equipment specifications
Surface defect and height variation detection equipment

型號 | SE-5AT2 |
---|---|
氣源規格 | 6-7 Kgf/cm2 |
資料數據化 / 雲端化 | 量測結果數據可輸出報表,並可與API對接,將量測結果
數據拋轉至客戶內部系統整合。 |
機台尺寸 | 1200L*1000W*1779H (mm) |
待測平台 | 2 / 4 / 5 / 6 / 8 / 12 吋陶瓷眞空吸附檯面 |
位移平台重複精度 | ≤±3μm |
白光共軛焦重複精度 | ±1μm |
白光共軛焦量測項目 | THK / TTV / WARP / BOW |
瑕疵檢測精度(光學解析度) | ±1μm |
瑕疵量測項目 | 孔洞、毛邊、色差、異物沾黏、髒污、龜裂、刮傷...等外觀缺陷 |
Image Detection
Measurement interface

AI judgment results clearly show the defect type, coordinates, area, and quantity on the wafer, and the data is fully integrated


Chip mapping defect detection screen